| Model | D200 |
| Colors | Black , White |
| Case Type | MATX |
| Materials | SPCC / Tempered Glass / ABS |
| M/B Compatibility | ITX / M-ATX |
| Expansion Slots | 5 Slots |
| Maximum Compatibility | VGA Card Length: ≤410mm |
| CPU Heatsink Height: 171mm | |
| I/O Ports | USB3.2 Gen2 Type-C*1 |
| USB3.0*2 | |
| AUDIO & MIC*1 | |
| Internal Drive Bays | 2.5″SSD*1 , 3.5″HDD*1 or 2.5″SSD*1 |
| Thermal Solution Compatibility | Air Cooling Fans: |
| Top 120mm*3/140*2(optional) | |
| Rear 120mm*1(optional) | |
| Power Compartment 120mm*3(optional) | |
| Water Cooling Radiator: | |
| Top 240mm*1 (optional) | |
| Product Dimensions | 437mm (D) * 216mm (W) * 419mm (H) |
| Net Weight | 6.11 KG |
| Gross Weight | 9.0 KG |
| Color | Warranty | Specification |
| Black , White | 1-Y | Size : MATX |
| MB Support : ITX / M-ATX | ||
| Air Cooling Fans:
Top 120mm*3/140*2(optional); Rear 120mm*1(optional); Power Compartment 120mm*3(optional) Water Cooling Radiator: |
||
| Color : Black , White | ||
| Front ports : USB3.2 Gen2 Type-C*1 / USB3.0*2 / AUDIO*1+MIC*1(2 in 1） |
||
| Material : SPCC / Tempered Glass / ABS | ||
| VGA Card Length: ≤410mm CPU Heatsink Height: 171mm |
Model：i100 Pro (Tempered Glass)
Color：Black / Silver
Material : ·Front and rear and boths sides panel : 3.0mm aluminum alloy panel with 120#-150# sandblasting finishing ·Grille top Cover: ABS + PC Mechanical purposes plastic ·Inner structure: 1.0 +1.5mm steel panel with black powder coat finishing ·Dual layers Case stand with aluminum alloyDimension：194mm(W) x 307mm(H) x 435mm(L) (not include case stand)
Motherboard： ITX / DTX
Storage : 1×3.5",2×2.5" Or 3×2.5"
GPU Support: 345-373mm (L)*160mm(H) *62mm (W) max (Install side mounted dual SSD : 345mm (L), w/o SSD : 373mm(L))
Max. CPU Cooler Height：166 max for Horizontal Mode / 77mm max for Vertical Mode
Radiator Support: 360/280/240/120 (fan +radiator max thickness : 55mm)Front I/O Port：USB 3.1 Gen2 TYPE-C×1, USB3 .0×1, AUDIO×1, MIC×1
PSU Support：w/o bottom fan: ATX PSII/SFX : 175mm max length
PCI-e 3.0 16 X 8Gs riser caber includedModel：i100 Pro (Tempered Glass)
Color：Black / Silver
Material : ·Front and rear and boths sides panel : 3.0mm aluminum alloy panel with 120#-150# sandblasting finishing ·Grille top Cover: ABS + PC Mechanical purposes plastic ·Inner structure: 1.0 +1.5mm steel panel with black powder coat finishing ·Dual layers Case stand with aluminum alloyDimension：194mm(W) x 307mm(H) x 435mm(L) (not include case stand)
Motherboard： ITX / DTX
Storage : 1×3.5",2×2.5" Or 3×2.5"
GPU Support: 345-373mm (L)*160mm(H) *62mm (W) max (Install side mounted dual SSD : 345mm (L), w/o SSD : 373mm(L))
Max. CPU Cooler Height：166 max for Horizontal Mode / 77mm max for Vertical Mode
Radiator Support: 360/280/240/120 (fan +radiator max thickness : 55mm)Front I/O Port：USB 3.1 Gen2 TYPE-C×1, USB3 .0×1, AUDIO×1, MIC×1
PSU Support：w/o bottom fan: ATX PSII/SFX : 175mm max length
PCI-e 3.0 16 X 8Gs riser caber included
| Color | Warranty | Specification |
| Black | 1 Year | DIMENSIONS : 169mm(W)*273mm(H)*340mm(D) |
| MATERIAL：Aluminium Magnesium alloy | ||
| SURFACE TREATMENT：Polishing+Sandblasting |
| Color | Warranty | Specification |
| Black | 1 Year | DIMENSIONS : 169mm(W)*273mm(H)*340mm(D) |
| MATERIAL：Aluminium Magnesium alloy | ||
| SURFACE TREATMENT：Polishing+Sandblasting |
SHADOW 240
Intel Socket LGA 2011/115X/775
AMD Socket FM2+/FM1/AM4/AM3/AM2+/AM2
The cooler pipe is designed to use 14 pipes to improve the heat dissipation
Built-in ultra quiet & high efficient Water Block and minimized
Tube Connection help Coolant rotate fast and stable
Easy Installation and Maintenance
No need to replace Coolant
2*120mm 5V ARGB quiet fans are used (PWM)
High efficient heat transfer by Aluminum alloy Radiator (240mm)
Super-thin design Water Block (Pump)
Pure cooper Water Block and Inner Micro-fin applied for quick heat transfer
Wear resistant flame retardant and anti leakage water pipe using EPDM+IIR material
Excellent compatibility supporting AMD/INTEL Motherboard
SHADOW 240
Intel Socket LGA 2011/115X/775
AMD Socket FM2+/FM1/AM4/AM3/AM2+/AM2
The cooler pipe is designed to use 14 pipes to improve the heat dissipation
Built-in ultra quiet & high efficient Water Block and minimized
Tube Connection help Coolant rotate fast and stable
Easy Installation and Maintenance
No need to replace Coolant
2*120mm 5V ARGB quiet fans are used (PWM)
High efficient heat transfer by Aluminum alloy Radiator (240mm)
Super-thin design Water Block (Pump)
Pure cooper Water Block and Inner Micro-fin applied for quick heat transfer
Wear resistant flame retardant and anti leakage water pipe using EPDM+IIR material
Excellent compatibility supporting AMD/INTEL Motherboard
| Model：DY-2 GPU 2*8Pin (6+2) |
| Dimension：Whole unit 345mm Cable 300mm |
| Voltage：Cable 300V Light 5V |
| Current：Cable 7A Light 0.81A |
| Power Consumption：Cable 2.1KW Light 4.05W |
| Connector：2*8Pin /5V ARGB |
| Model：DY-2 GPU 2*8Pin (6+2) |
| Dimension：Whole unit 345mm Cable 300mm |
| Voltage：Cable 300V Light 5V |
| Current：Cable 7A Light 0.81A |
| Power Consumption：Cable 2.1KW Light 4.05W |
| Connector：2*8Pin /5V ARGB |
U5 is a product developed based on ATX motherboard specifications. The shell is made of 2.0MM aluminum magnesium alloy The main purpose of U5 development is to further optimize the length support of video card an power supply of Jonsbo middle-level aluminum case, to increase the height support for backplate wiring management, and to optimize the top spacing for better liquid cooler support. In the heat dissipation, 3 fans design on the bottom improve the air intake of the case and so optimize the overall heat dissipation performance. With numerous optimizations, there is no restriction for supporting high-end hardware anymore, users can easily build an unlimited high-performance computing platform with elegant metal texture.
U5 is a product developed based on ATX motherboard specifications. The shell is made of 2.0MM aluminum magnesium alloy The main purpose of U5 development is to further optimize the length support of video card an power supply of Jonsbo middle-level aluminum case, to increase the height support for backplate wiring management, and to optimize the top spacing for better liquid cooler support. In the heat dissipation, 3 fans design on the bottom improve the air intake of the case and so optimize the overall heat dissipation performance. With numerous optimizations, there is no restriction for supporting high-end hardware anymore, users can easily build an unlimited high-performance computing platform with elegant metal texture.
